BGA PCB Assembly

BGA Capabilities

BGA Assembly Testing Procedure

The X-ray inspection method is widely used for testing BGA assembly. This helps identify various soldering defects like melting of balls holding connections, paste bridging, damaged connections, etc. Besides this, the X-ray support software is capable of calculating the gap size in the ball, to ensure that it follows the IPC Class II standard.

Our experienced technicians can use 2D X-rays for rendering 3D images. This helps to identify inner problems such as cold soldering of BGA balls, damaged Via’s in inner layers.

The ball grid assembly provides various advantages, and are becoming integral part of electronic circuits.

• Improved Manufacturing: BGA assembly helps improve soldering, which further improves manufacturing yields. Ball grid arrays feature wide spacing between connections, which also improves the solderability.
• No Pin Bridging: BGAs are used in miniature packages for ICs having hundreds of pins. As a BGA improves solderability, there are lesser or no chances of adjacent pins bridging together when the solder is applied.
• Efficient Use of Space: BGAs allow efficient use of space on a printed circuit board. This helps add connections around the edges, as well as under the SMD package.
• Low-inductance Leads: Ball grid arrays have very short space between the PCB and package. They have low inductances and so, have superior electrical performance to leaded devices.
• Heat Conduction:Ball grid array packages with distinct leads have lesser resistance to heat between the PCB and the package. This lets the heat generated by an IC inside the package to flow more effortlessly to the PCB. This protects the chip from getting overheated.

Industries Served

With the capabilities mentioned in the table above, it has helped us to serve a wide range of industries varying from:

• Aerospace and Satellite
• LED Industry
• Medical industries
• Wireless, military, and telecommunications industries.

Certifications

The skilled technicians and engineers work with you to understand your product requirements and deliver a product that best suits your application requirements. We follow all the required industry standards such as:

• ISO 9001:2008 Certified
• IPC-WHMA-A-610 Compliant
• IPC-CC-830B Compliant
• All assemblies built to IPC-A-610-D & ANSI/J-STD-001 standards
• SBA certified

You can contact us for any queries about our BGA Assembly services. Feel free to call us at 224.653.4000, or email at sales@creativehitech.com. We will get back to you within one business day.

Related Blog Post:

• Tips for Doing BGA Soldering the Right Way
• What are the Steps in BGA Repairing? Part I
• What are the Steps in BGA Repairing? – Part II
• What to do with Old Circuit Boards